JPH0430741B2 - - Google Patents

Info

Publication number
JPH0430741B2
JPH0430741B2 JP59127005A JP12700584A JPH0430741B2 JP H0430741 B2 JPH0430741 B2 JP H0430741B2 JP 59127005 A JP59127005 A JP 59127005A JP 12700584 A JP12700584 A JP 12700584A JP H0430741 B2 JPH0430741 B2 JP H0430741B2
Authority
JP
Japan
Prior art keywords
flexible film
opening
lead group
group
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59127005A
Other languages
English (en)
Japanese (ja)
Other versions
JPS616832A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59127005A priority Critical patent/JPS616832A/ja
Publication of JPS616832A publication Critical patent/JPS616832A/ja
Publication of JPH0430741B2 publication Critical patent/JPH0430741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59127005A 1984-06-20 1984-06-20 実装体 Granted JPS616832A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59127005A JPS616832A (ja) 1984-06-20 1984-06-20 実装体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59127005A JPS616832A (ja) 1984-06-20 1984-06-20 実装体

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP6256503A Division JP2606673B2 (ja) 1994-10-21 1994-10-21 実装体
JP6256502A Division JP2568812B2 (ja) 1994-10-21 1994-10-21 実装体

Publications (2)

Publication Number Publication Date
JPS616832A JPS616832A (ja) 1986-01-13
JPH0430741B2 true JPH0430741B2 (en]) 1992-05-22

Family

ID=14949322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59127005A Granted JPS616832A (ja) 1984-06-20 1984-06-20 実装体

Country Status (1)

Country Link
JP (1) JPS616832A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223124A (ja) * 1985-07-23 1987-01-31 Sharp Corp フィルムキャリアｌｓｉ
JPH07122713B2 (ja) * 1988-07-11 1995-12-25 株式会社東芝 フレキシブル配線基板及びその製造方法及び電子部品
JP2538112Y2 (ja) * 1991-05-21 1997-06-11 シャープ株式会社 実装基板
JP2570519B2 (ja) * 1991-06-05 1997-01-08 日立電線株式会社 Ｔａｂ用テープキャリア
JP2763445B2 (ja) * 1992-04-03 1998-06-11 三菱電機株式会社 高周波信号用配線及びそのボンディング装置
KR100524484B1 (ko) * 1998-07-29 2006-01-12 삼성전자주식회사 엘시디 모듈

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51140174A (en) * 1975-05-28 1976-12-02 Sharp Kk Method of connecting flexible substrate and other devices
JPS538575U (en]) * 1976-07-07 1978-01-25
JPS5364248U (en]) * 1976-11-04 1978-05-30
JPS55166988A (en) * 1979-06-14 1980-12-26 Olympus Optical Co Flexible printed circuit board
JPS5775450A (en) * 1980-10-28 1982-05-12 Matsushita Electric Ind Co Ltd Manufacture of electronic circuit device
JPS58188684U (ja) * 1982-06-10 1983-12-15 セイコーエプソン株式会社 電子表示装置
JPS60216573A (ja) * 1984-04-12 1985-10-30 Seiko Epson Corp フレキシブル印刷配線板の製造方法

Also Published As

Publication number Publication date
JPS616832A (ja) 1986-01-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term